MEMS · NEMS · Design · Microfabrication · Production Transfer

MEMS NEMS DESIGN - FEA
Fabrication
Production Transfer

Industrial experts in MEMS/NEMS, Production oriented FEA based design, Process integration, Optimized Mask layout, Qualification, Production Transfer, Failure analysis, 3D Modelling, FEA based Packaging Analysis.

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25+
Industrial Experience
IP
Solid Background in IP Generation
HVM
Impressive MEMS/NEMS Production Transfer
MEMS · NEMS · Design · Microfabrication · FEA · Production Transfer · Process Integration · Mask Layout · Failure Analysis · 3D Modelling · MEMS · NEMS · Design · Microfabrication · FEA · Production Transfer · Process Integration · Mask Layout · Failure Analysis · 3D Modelling ·
What We Do

Core Services

From process development to high-volume manufacturing transfer — precision engineering at every scale, from wafer to device.

01 — Design
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MEMS NEMS Design & FEA

FEA based micro/nano structure design following Design for Six Sigma methodology. Optimum mask layout for stepper, contact and direct write. Solid modelling for packaging and packaging analysis.

FEA Mask Layout Solid Modelling Packaging
02 — Process
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Process Integration & Development

End-to-end MEMS process flow design, multi-mask process development, and optimization for yield and device performance.

Process Interaction Assessment & Selection Lithography Modality Tolerance Analysis Short Loops
03 — Fabrication
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Process Setup, SOP and Process Run

Process setup including equipment procurement, process and equipment qualification, and comprehensive standard operating procedure documentation.

Wafer Resizing Substrates Silicon Glass TGV Lithography Dry Etch DRIE Wet Etch CVD PECVD Metal Deposition
04 — Transfer
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Technology Transfer to HVM

Proven track record transferring R&D processes to high-volume manufacturing partners. Process qualification, yield optimization, and full documentation for seamless production scale-up.

HVM Yield Qualification Scale-Up
05 — Technical
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Technical Writing & Grant Support

SBIR/STTR proposal writing, process documentation, patent preparation support, and peer-review quality technical reporting.

SBIR Patents Reports
06 — Advisory
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Expert Consulting & Due Diligence

Technical advisory for investors and startups, equipment evaluation, vendor selection, and process feasibility assessment.

Advisory Due Diligence Strategy
Track Record

Selected Projects

FEA · ANSYS 2024 R2 · Device Optimization

Finite Element Analysis for Device Optimization

Every design at SF NEMS & MEMS undergoes rigorous FEA simulation up front to improve device reliability and minimize failure rate before any material is touched. Structural, modal, and stress analysis performed in ANSYS to validate geometry, identify stress concentration zones, and in the project shown to the right, optimize suspension spring designs for maximum yield and performance.

FEA
Up-Front Analysis
56K
Max Stress psi
↓
Failure Rate Minimized
ANSYS FEA mesh of microneedle structure ANSYS nodal stress solution principal stress S1

ANSYS 2024 R2 · Nodal Solution S1 · SMX = 56,258 psi

MEMS Design & FEA · Mode-Matched

Mode-Matched Tuning Fork Gyroscope

High-performance silicon MEMS tuning fork gyroscope featuring two symmetrical proof masses connected via a central coupling beam. Interdigitated gold comb drive electrodes on lateral sides enable anti-phase drive mode actuation. Folded suspension springs provide mechanical compliance in drive axis while maintaining sense-axis stiffness. Designed for mode-matched operation with high-Q resonance and ultra-low noise angular rate detection.

* Image for demonstration purpose only.

HQ
High-Q Design
FEA
Mode Matched
SOI
Wafer Platform
Mode-matched MEMS tuning fork gyroscope
Optical MEMS · 2×2 Switch

2×2 Optical MEMS Switch

Silicon MEMS optical switch featuring electrostatic comb drive actuators, folded beam suspension springs, and precision-etched mirror structures. Developed for low-loss optical path switching with high repeatability and fast response time.

* Image for demonstration purpose only.

2×2
Switch Matrix
DRIE
Si Etch Process
Optical MEMS switch SEM 1 Optical MEMS switch SEM 2
Drug Delivery · Silicon Microfabrication

Silicon Microneedle Array for Drug Delivery

Microfabricated silicon microneedle arrays for transdermal drug delivery applications. Sharp needle tips with sub-micron apex radius achieved through optimized proprietary etch process. SEM image shows needle tip at 675× magnification — 20μm scale bar confirms precision geometry.

Silicon microneedle SEM image 675x magnification
675×
SEM Magnification
20μm
Scale
DRIE
Etch Process
Who We Are

About SF NEMS & MEMS

SF NEMS & MEMS delivers expert MEMS/NEMS design, FEA-driven multiphysics modeling, process development, and microfabrication solutions for semiconductor companies, startups, and research institutions.

Our industry-proven team brings decades-long expertise in both FEA-based design and hands-on fabrication, developed across advanced environments including GE, Merit Medical, HP, and premier research facilities such as the Stanford Nanofabrication Facility.

We integrate physics-based simulation with deep process knowledge to ensure designs are not only innovative, but fabrication-ready and performance-optimized.

From concept through production, we bridge the critical gap between R&D and manufacturing — translating complex designs into robust, scalable, and yield-driven processes.

Core Expertise
Comprehensive FEA-Based Design
IP Generation & Patent Filing Support
Process Integration
Generate Direct Write, Stepper & Contact Photo Masks
Microfabrication
Transfer into Volume Production
Qualification Support
Failure Analysis
Solid Modelling
Grant Submission Support
25+
Years Making Industrial MEMS for High Volume
Let's Work Together

Get In Touch

Whether you need process development support, cleanroom guidance, or technical consulting — we're ready to engage. Initial consultations are available remotely or in-person in the Bay Area.

📍
Location
Palo Alto, CA · San Francisco Bay Area
✉
Email
info@sf-nems-mems.com
🔗
⏱
Availability
Project-based execution with a fast track to production
Send a Message
Available Now

Excess Wafers

SF NEMS & MEMS periodically makes surplus wafers available for direct purchase. These are high-quality materials sourced from completed projects. Inventory changes frequently — we encourage you to check back regularly or contact us to be notified when new stock becomes available.

Present Left Over Wafer Inventory
1
Available Now: 100 mm SOI Wafers, Two Different Device Layer Thicknesses
For specifications and pricing enquiries contact info@sf-nems-mems.com
In Stock